• intloko_ibhena_01

Okusingqongileyo

  • Thermal Shock Test Chamber

    Thermal Shock Test Chamber

    I-Thermal Shock Test Chambers isetyenziselwa ukuvavanya utshintsho lweekhemikhali okanye umonakalo womzimba obangelwa ukwanda kwe-thermal kunye nokunciphisa isakhiwo sezinto eziphathekayo okanye i-composite.Isetyenziselwa ukuvavanya iqondo lotshintsho lweekhemikhali okanye umonakalo womzimba obangelwa ukwanda kwe-thermal kunye nokucutheka ngexesha elifutshane ngokubeka izinto ngokuqhubekayo kwi-exposure eqhubekayo yokushisa okuphezulu kakhulu kunye nokuphantsi.Ilungele ukusetyenziswa kwizinto ezifana nesinyithi, iiplastiki, irabha, i-electronics njl. kwaye ingasetyenziselwa njengesiseko okanye ireferensi yokuphucula imveliso.

  • Ukuxhasa igumbi lokuvavanya ukothuka kwe-thermal

    Ukuxhasa igumbi lokuvavanya ukothuka kwe-thermal

    Iqondo lokushisa elishushu nelibandayo lovavanyo lwenkqubo yoyilo loyilo lwenkqubo yoyilo lwetekhnoloji yolawulo lwamandla, indlela engqiniweyo yokuqinisekisa ukusebenza okuqhelekileyo kweyunithi yesikhenkcezisi kunokuba nolawulo olusebenzayo lwenkqubo yefriji yokusetyenziswa kwamandla kunye nomthamo wokupholisa, ukuze iindleko zokusebenza ze inkqubo yefriji kunye nokungaphumeleli ukuya kwimeko yezoqoqosho ngakumbi.

  • Ubushushu obuphantsi boMtshini woVavanyo lwe-Cold Resistance

    Ubushushu obuphantsi boMtshini woVavanyo lwe-Cold Resistance

    1, Umzi-mveliso ophucukileyo, iteknoloji ehamba phambili

    2, ukuthembeka kunye nokusebenza

    3, Ukhuseleko lokusingqongileyo kunye nokonga amandla

    I-4, Ukwenziwa komntu kunye nolawulo lwenethiwekhi ye-automated

    5 、 Kwangexesha kwaye igqibelele inkqubo yenkonzo emva kwentengiso enesiqinisekiso sexesha elide.

  • Ioveni enkulu enobushushu obuphezulu obungaqhubi

    Ioveni enkulu enobushushu obuphezulu obungaqhubi

    I-oveni enkulu enobungqina bobushushu obuphezulu isetyenziselwa ukufudumeza, ukunyanga, ukomisa ukufuma njalo njalo kwinkqubo yemveliso.Le mveliso inokhuseleko olulungileyo, isiphumo esihle kakhulu sokugcina amandla, ukugquma kakuhle kwe-thermal, ukufana okuhle kobushushu.Uninzi lwazo lusetyenziswa kwishishini lerabha, unyango lwepeyinti ye-hardware, ukufuma okomisa umgubo, ukomisa iimveliso ze-elektroniki, ukuhluthwa kwemodeli yemoto, ukomisa i-sludge kwishishini, njl., ukomisa, ukunyanga okanye ukuguga izixhobo zokomisa ezifunekayo kwinkqubo yokuvelisa iimveliso ezahlukeneyo.Ngoyilo olukhethekileyo lwenkqubo eyomeleleyo yokujikeleza ukuqhuma ukuqinisekisa ukuzinza kweqondo lokushisa, isixhobo sokulawula ubushushu usebenzisa ulawulo lobushushu bokubonisa idijithali, ukubonwa kwamehlo okubonakalayo, kunye nesixhobo sokukhusela ukuthembeka.Isixhobo sisetyenziswa kakhulu kushishino, iilabhoratri, amaziko ophando, iiyunivesithi kunye namanye amashishini kunye namaziko.

  • IBhafu yeThermostatic yobushushu obuphantsi

    IBhafu yeThermostatic yobushushu obuphantsi

    1. Ifektri ephucukileyo, iteknoloji ehamba phambili

    2. Ukuthembeka kunye nokusebenza

    3. Ukukhuselwa kwendalo kunye nokonga amandla

    4. I-Humanization kunye ne-automated system network management

    5. Inkqubo yenkonzo yexesha kunye negqibeleleyo emva kwentengiso enesiqinisekiso sexesha elide.

  • Xenon isibane ukuguga uvavanyo igumbi

    Xenon isibane ukuguga uvavanyo igumbi

    Izibane ze-Xenon arc zilinganisa ukukhanya okugcweleyo kwelanga ukuvelisa amaza okukhanya atshabalalisayo akhoyo kwiindawo ezahlukeneyo, kwaye zinokubonelela ngokulinganisa okufanelekileyo kokusingqongileyo kunye novavanyo olukhawulezileyo lophando lwezenzululwazi, uphuhliso lwemveliso kunye nolawulo lomgangatho.

    Ngokusebenzisa iisampulu eziphathekayo ezivezwe kwisibane sesibane se-xenon arc kunye nemitha ye-thermal yokuvavanya ukuguga, ukuvavanya umthombo wokukhanya obushushu obuphezulu phantsi kwesenzo sezinto ezithile, ukumelana nokukhanya, ukusebenza kwemozulu.Isetyenziswa kakhulu kwiimoto, iingubo, irabha, iplastiki, i-pigment, i-adhesives, amalaphu, i-aerospace, iinqanawa kunye nezikhephe, ishishini lombane, ishishini lokupakisha njalo njalo.